Multi-layer board market development prospects


In recent years, with the advancement of VLSI and miniaturization of electronic components and high integration, multi-layer boards are moving in the direction of high-performance circuits, which is why there is a growing demand for high-density lines and high wiring capacity. The requirements for electrical characteristics (such as Crosstalk, integration of impedance characteristics) are more stringent. The popularity of multi-legged parts and surface-mount components (SMD) makes the circuit board pattern more complex, the conductor lines and apertures are smaller, and the development of high-layer boards (10-15 layers) is popular. . In the latter half of the 1980s, thin-layer multi-layer boards with a thickness of 0.4 to 0.6 mm were gradually popularized for high-density wiring and small holes in line with small and lightweight requirements. The hole guide and shape of the part are completed by punching. In addition, some of the products produced in small quantities and diversely use a photoreceptor to form a pattern.


High-power amplifier - Substrate: ceramic + FR-4 plate + copper base, number of layers: 4 layers + copper base, surface treatment: immersion gold, features: ceramic + FR-4 sheet mixed lamination, with copper-based pressure knot.


Military high-frequency multi-layer board - Substrate: PTFE, thickness: 3.85mm, number of layers: 4 layers, features: blind buried holes, silver paste hole filling.


Green product - Substrate: Environmentally friendly FR-4 sheet, thickness: 0.8mm, number of layers: 4 layers, size: 50mm × 203mm, line width / line spacing: 0.8mm, aperture: 0.3mm, surface treatment: immersion gold, Shen Xi.


High-frequency, high-Tg device - Substrate: BT, number of layers: 4 layers, thickness: 1.0mm, surface treatment: gold.


Embedded System - Substrate: FR-4, number of layers: 8 layers, thickness: 1.6mm, surface treatment: spray tin, line width / line spacing:

4mils/4mils, solder resist color: yellow.


DCDC, power module - Substrate: high Tg thick copper foil, FR-4 sheet, size: 58mm × 60mm, line width / line spacing: 0.15mm, aperture: 0.15mm, thickness: 1.6mm, number of layers: 10 layers , Surface treatment: immersion gold, features: each layer of copper foil thickness 3OZ (105um), blind buried hole technology, high current output.


High-frequency multilayer board - Substrate: ceramic, number of layers: 6 layers, thickness: 3.5mm, surface treatment: immersion gold, features: buried holes.


Photoelectric conversion module - Substrate: ceramic + FR-4, size: 15mm × 47mm, line width / line spacing: 0.3mm, aperture: 0.25mm, number of layers: 6 layers, thickness: 1.0mm, surface treatment: gold plating + Gold finger, features: embedded positioning.


Backsheet - Substrate: FR-4, number of layers: 20 layers, thickness: 6.0mm, outer copper thickness: 1/1 ounce (OZ), surface treatment: immersion gold.


Micro Module - Substrate: FR-4, number of layers: 4 layers, thickness: 0.6mm, surface treatment: immersion gold, line width / line spacing:


4mils/4mils, features: blind holes, semi-conductive holes.


Communication base station - Substrate: FR-4, number of layers: 8 layers, thickness: 2.0mm, surface treatment: spray tin, line width / line spacing:


4mils/4mils, features: dark solder mask, multi-BGA impedance control.


Data Collector - Substrate: FR-4, number of layers: 8 layers, thickness: 1.6mm, surface treatment: immersion gold, line width / line spacing: 3mils / 3mils, solder mask color: green matte, features: BGA Impedance control.

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